DocumentCode :
41757
Title :
Modeling, Design, and Fabrication of High-Inductance Bond Wire Microtransformers With Toroidal Ferrite Core
Author :
Macrelli, Enrico ; Romani, Aldo ; Ningning Wang ; Roy, Saibal ; Hayes, Mike ; Paganelli, Rudi Paolo ; Mathuna, Cian O. ; Tartagni, Marco
Author_Institution :
Adv. Res. Center on Electron. Syst., Univ. of Bologna, Cesena, Italy
Volume :
30
Issue :
10
fYear :
2015
fDate :
Oct. 2015
Firstpage :
5724
Lastpage :
5737
Abstract :
This paper presents the design of miniaturized bond wire transformers assembled with standard IC bonding wires and NiZn and MnZn ferrite toroidal cores. Several prototypes are fabricated on a printed circuit board substrate with various layouts in a 4.95 mm × 4.95 mm area. The devices are modeled by analytical means and characterized with impedance measurements over a wide frequency range. Experimental results on 1:38 device show that the secondary self-inductance increases from 0.3 μH with aircore to 315 μH with ferrite core; the coupling coefficient improves from 0.1 with air-core to 0.9 with ferrite core; the effective turns ratio enhances from 0.5 with air-core to 34 with ferrite core. This approach is cost effective and enables a flexible design of efficient micromagnetics on top of ICs with dc inductance to resistance ratio of 70 μH/Ω and an inductance per unit area of 12.8 μH/mm2 up to 0.3 MHz. The design targets the development of bootstrap circuits for ultralow voltage energy harvesting. In this context, a low-voltage step-up oscillator suitable for thermoelectric generator sources is realized with a commercial IC and the proposed microtransformers. Experimental measurements on a discrete prototype report that the circuit bootstraps from voltages down to 260 mV and outputs a dc voltage of 2 V.
Keywords :
bootstrap circuits; energy harvesting; ferrites; thermoelectric conversion; transformer cores; bootstrap circuits; high-inductance bond wire microtransformers; impedance measurements; low-voltage step-up oscillator; printed circuit board substrate; standard IC bonding wires; thermoelectric generator sources; toroidal ferrite core; ultralow voltage energy harvesting; voltage 2 V; Bonding; Circuit faults; Ferrites; Inductors; Magnetic cores; Toroidal magnetic fields; Wires; Bonding processes; converters; energy harvesting (EH); ferrites; magnetic cores; oscillators; permeability; power supply in package (PwrSiP); power supply on chip (PwrSoC); printed circuits; thermoelectric; transformers;
fLanguage :
English
Journal_Title :
Power Electronics, IEEE Transactions on
Publisher :
ieee
ISSN :
0885-8993
Type :
jour
DOI :
10.1109/TPEL.2014.2370814
Filename :
6955850
Link To Document :
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