Title :
RF robustness enhancement through statistical analysis of chip package co-design
Author :
Duo, Xinzhong ; Zheng, Li-Rong ; Tenhunen, Hannu
Author_Institution :
Lab. of Electron. & Comput. Syst., R. Inst. of Technol., Stockholm, Sweden
Abstract :
In order to enhance robustness of RF circuits, a flow of statistical analysis for chip-package co-design of RF system-on-package (SoP) is presented in this work. Methods for improving the yield of RF modules are developed. On-chip passive components versus off-chip passive components trade-offs on SoP module were also analyzed in terms of performance and yield. The design methods were demonstrated through case studies of LNA (low noise amplifier) in SoP.
Keywords :
chip scale packaging; integrated circuit yield; multichip modules; RF circuits; RF modules; RF robustness enhancement; RF system-on-package; SoP module; chip package co-design; low noise amplifier; off-chip passive components; on-chip passive components; statistical analysis; Circuit analysis; Conducting materials; Costs; Design optimization; Manufacturing processes; Performance analysis; Radio frequency; Robustness; Statistical analysis; Uncertainty;
Conference_Titel :
Circuits and Systems, 2004. ISCAS '04. Proceedings of the 2004 International Symposium on
Print_ISBN :
0-7803-8251-X
DOI :
10.1109/ISCAS.2004.1328363
