DocumentCode :
418219
Title :
Powder-based fabrication techniques for single-wall carbon nanotube circuits
Author :
Dai, D. ; Ismail, Y. ; Wang, Wei ; Ladak, H.
Author_Institution :
Electr. & Comput. Eng., Northwestern Univ., Evaston, IL, USA
Volume :
3
fYear :
2004
fDate :
23-26 May 2004
Abstract :
In this paper, powder-based fabrication techniques are proposed, which are essential for the fabrication of single-wall carbon nanotube (SWNT) circuit. As an alternative to the more demanding chemical vapour deposition methods, the powder-based fabrication technique is simple and cost-effective. In this study, five powder-based preparation techniques are proposed and compared. The one using ultra centrifuge and spinner yields a high concentration of SWNTs evenly distributed on the same, ideal for constructing small SWNT circuits. Furthermore, techniques to separate metallic and semiconducting SWNTs are discussed. The proposed preparation and separation techniques are very important since they form the basis for the study of SWNT circuits. The proposed techniques are expected to have a huge impact on the SWNT circuit fabrication and design.
Keywords :
carbon nanotubes; materials preparation; nanotechnology; powder technology; SWNT circuit; chemical vapour deposition; metallic SWTN; nanotechnology; powder-based fabrication; preparation technique; semiconducting SWNT; separation technique; single-wall carbon nanotube; CMOS integrated circuits; CMOS technology; Carbon nanotubes; Chemical vapor deposition; Fabrication; Integrated circuit interconnections; MOSFET circuits; Nanotechnology; Semiconductivity; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Circuits and Systems, 2004. ISCAS '04. Proceedings of the 2004 International Symposium on
Print_ISBN :
0-7803-8251-X
Type :
conf
DOI :
10.1109/ISCAS.2004.1328843
Filename :
1328843
Link To Document :
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