Electrical connectivity analysis of a MEMS micropackage

A 3-D modular micropackage has been designed using MEMS technology that can provide electrical connectivity among dies or devices of diverse technological origin, while providing excellent mechanical protection and thermal management. The MEMS modules can be vertically integrated using a microbus card and channel concept to provide the necessary electronic connectivity. This significantly reduces interconnection lengths and the related transmission line effects. In this paper an analysis of the electrical connectivity of the proposed microbus card and channel system is presented. A lumped parameter frequency variant model of the interconnection path has been derived. Both time and frequency domain analysis has been carried out to obtain pulse propagation properties and frequency response results. The analysis shows that excellent high-speed interconnectivity at frequencies up to 10 GHz can be achieved with the proposed microbus card and channel interconnection system.