DocumentCode :
418506
Title :
Decoupling technique and crosstalk analysis for coupled RLC interconnects
Author :
Zhang, Junmou ; Friedman, Eby G.
Author_Institution :
Dept. of Electr. & Comput. Eng., Rochester Univ., NY, USA
Volume :
2
fYear :
2004
fDate :
23-26 May 2004
Abstract :
With lower wire resistance and faster signal rise times, the on-chip inductance plays an important role in determining the circuit performance and signal integrity characteristics. The self and mutual inductance must be considered in the analysis of crosstalk noise between coupled RLC interconnects. Based on the ABCD parameter matrix, a decoupling technique for two coupled identical RLC interconnects is developed. The inductances (capacitances) of two decoupled interconnects are the effective inductances (capacitances) when both inputs switch in the same and inverse direction, respectively. A model of the peak crosstalk noise is developed based on this decoupling technique, with the peak noise occurring at the time of flight tfmax or 3tfmax. The model exhibits an average error of 6.8% as compared to SPICE. The peak crosstalk noise does not necessarily increase with greater coupling inductance or capacitance. The decoupling technique is further extended to two non-identical coupled interconnects, providing an upper limit on the peak crosstalk noise.
Keywords :
RLC circuits; capacitance; coupled circuits; crosstalk; error analysis; inductance; integrated circuit interconnections; integrated circuit noise; system-on-chip; time of flight spectra; circuit performance; coupled RLC interconnect; coupling capacitance; coupling inductance; crosstalk noise analysis; decoupling; effective inductance; flight time; lower wire resistance; matrix parameter; mutual inductance; on chip inductance; peak crosstalk noise; self inductance; signal integrity properties; Capacitance; Circuit optimization; Coupling circuits; Crosstalk; Inductance; Integrated circuit interconnections; Mutual coupling; SPICE; Switches; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Circuits and Systems, 2004. ISCAS '04. Proceedings of the 2004 International Symposium on
Print_ISBN :
0-7803-8251-X
Type :
conf
DOI :
10.1109/ISCAS.2004.1329323
Filename :
1329323
Link To Document :
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