Title :
Dielectric properties of polymer materials at a high microwave frequency [microwave processing]
Author :
Zong, Liming ; Kempel, Leo C. ; Hawley, Martin C.
Author_Institution :
Dept. of Chem. Eng. & Mater. Sci., Michigan State Univ., East Lansing, MI, USA
Abstract :
The dielectric properties of the diglycidyl ether of bisphenol-A (DGEBA) epoxy resin and diaminodiphenyl sulfone (DDS) crosslinking systems, at different extents of cure, have been studied at the temperature range of 25°C to 120°C at a frequency of 2.45 GHz. It has been shown that the systems exhibit only γ relaxation. The relaxation is attributed to the motions of the dipoles associated with the reacting systems and can be described by the Arrhenius rate law. A simple model is proposed to represent the temperature dependences of the dielectric properties at high microwave frequencies.
Keywords :
curing; dielectric losses; microwave heating; molecular moments; permittivity; polymers; relaxation; γ relaxation; 2.45 GHz; 25 to 120 degC; Arrhenius rate law; DDS; DGEBA diglycidyl ether; bisphenol-A epoxy resin; cure degree; diaminodiphenyl sulfone crosslinking systems; dielectric constant; dielectric loss factor; microwave frequency dielectric properties; microwave heating; microwave processing; polymer material dielectric properties; reacting system dipole motions; Curing; Dielectric losses; Dielectric materials; Dielectric measurements; Electromagnetic heating; Epoxy resins; Microwave frequencies; Polymers; Power system modeling; Temperature;
Conference_Titel :
Antennas and Propagation Society International Symposium, 2004. IEEE
Print_ISBN :
0-7803-8302-8
DOI :
10.1109/APS.2004.1329640
