A study of a microwave electromagnetic bandgap structure with waveguiding defect for potential use as a bandpass wireless interconnect

We have performed a computational and experimental study of a promising new wireless interconnect technology for high-speed digital circuits employing linear defects in electromagnetic bandgap structures. Our initial experimental results scaled to 10 GHz have verified the feasibility of achieving an approximately 80 % bandwidth with excellent stopband, gain flatness, and matching characteristics. When scaled to millimeter-wave center frequencies above 300 GHz (to leverage emerging silicon transistor technology), the wireless interconnects reported in this letter should be feasible of supporting data rates in the hundreds of gigabits per second, assuming the availability of suitable low-loss dielectrics.