Title :
CACTI-IO: CACTI With OFF-Chip Power-Area-Timing Models
Author :
Jouppi, Norman P. ; Kahng, Andrew B. ; Muralimanohar, Naveen ; Srinivas, Vaishnav
Author_Institution :
Google, Mountain View, CA, USA
Abstract :
In this paper, we describe CACTI-IO, an extension to CACTI that includes power, area, and timing models for the IO and PHY of the OFF-chip memory interface for various server and mobile configurations. CACTI-IO enables design space exploration of the OFF-chip IO along with the dynamic random access memory and cache parameters. We describe the models added and four case studies that use CACTI-IO to study the tradeoffs between memory capacity, bandwidth (BW), and power. The case studies show that CACTI-IO helps to: 1) provide IO power numbers that can be fed into a system simulator for accurate power calculations; 2) optimize OFF-chip configurations including the bus width, number of ranks, memory data width, and OFF-chip bus frequency, especially for novel buffer-based topologies; and 3) enable architects to quickly explore new interconnect technologies, including 3-D interconnect. We find that buffers on board and 3-D technologies offer an attractive design space involving power, BW, and capacity when appropriate interconnect parameters are deployed.
Keywords :
DRAM chips; cache storage; integrated circuit design; integrated circuit interconnections; integrated circuit modelling; three-dimensional integrated circuits; 3D interconnect; CACTI-IO; OFF-chip bus frequency; PHY; bandwidth; buffer-based topology; bus width; cache parameters; design space exploration; dynamic random access memory; memory capacity; memory data width; mobile configurations; off-chip power-area-timing models; server; system simulator; Clocks; Integrated circuit interconnections; Jitter; Mobile communication; Random access memory; Servers; Timing; CACTI; CACTI-IO; IO; dynamic random access memory (DRAM); memory interface; power and timing models;
Journal_Title :
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
DOI :
10.1109/TVLSI.2014.2334635