DocumentCode :
419228
Title :
Mixed electromagnetic and circuit simulations using a higher-order hybrid formulation
Author :
Champagne, Nathan J. ; Rockway, John D. ; Jandhyala, Vikram
Author_Institution :
Defense Sci. Eng. Div., Lawrence Livermore Nat. Lab., CA, USA
Volume :
3
fYear :
2004
fDate :
20-25 June 2004
Firstpage :
2775
Abstract :
Standard surface impedance approximations are invalid at frequencies approaching DC, since the cross sections of conductors are smaller than the skin depth. Hence, a volumetric formulation is typically used at these low frequencies for broadband simulation as necessitated in digital or ultra-wideband systems, since the skin effect can be modeled explicitly. This modeling requires fine and frequency dependent volume meshing. However, an approach using higher-order elements and/or bases may alleviate these requirements. The paper presents a tightly coupled circuit and hybrid boundary element (or integral equation)/finite element based electromagnetic simulation. The hybrid boundary element/finite element formulation is coupled with a technique for representing circuit-to-EM connections. Results are presented to validate the hybrid formulation compared to the boundary element formulation.
Keywords :
boundary-elements methods; circuit simulation; computational electromagnetics; finite element analysis; integral equations; surface impedance; boundary element; boundary element formulation; circuit simulation; circuit-to-EM connections; electromagnetic simulation; finite element; frequency dependent volume meshing; higher-order bases; higher-order elements; higher-order hybrid formulation; integral equation; skin depth; surface impedance approximations; volumetric formulation; Circuit simulation; Conductors; Coupling circuits; Electromagnetic coupling; Finite element methods; Frequency dependence; Integral equations; Skin effect; Surface impedance; Ultra wideband technology;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Antennas and Propagation Society International Symposium, 2004. IEEE
Print_ISBN :
0-7803-8302-8
Type :
conf
DOI :
10.1109/APS.2004.1331950
Filename :
1331950
Link To Document :
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