DocumentCode
419303
Title
Some novel techniques for fast simulation of mixed-signal IC and RF package design
Author
Yeo, Junha ; Kwon, Soonjae ; Mittra, Raj
Author_Institution
Dept. of Electr. Eng., Pennsylvania State Univ., University Park, PA, USA
Volume
3
fYear
2004
fDate
20-25 June 2004
Firstpage
3297
Abstract
In this paper we propose some novel techniques for fast simulation of mixed-signal IC and RF package design. The effectiveness of these techniques is demonstrated via several examples, and their suitability for implementation in electromagnetic (EM) software is discussed.
Keywords
circuit simulation; computational electromagnetics; integrated circuit packaging; mixed analogue-digital integrated circuits; radiofrequency integrated circuits; EM software; RF package design; electromagnetic software; mixed-signal IC; simulation; Circuit simulation; Circuit testing; Computational modeling; Integrated circuit modeling; Integrated circuit packaging; Message-oriented middleware; Radio frequency; Radiofrequency integrated circuits; Scattering parameters; Transmission line matrix methods;
fLanguage
English
Publisher
ieee
Conference_Titel
Antennas and Propagation Society International Symposium, 2004. IEEE
Print_ISBN
0-7803-8302-8
Type
conf
DOI
10.1109/APS.2004.1332084
Filename
1332084
Link To Document