Title :
Mass Sensitivity Evaluation and Device Design of a LOVE Wave Device for Bond Rupture Biosensors Using the Finite Element Method
Author :
Kui Han ; Yuan, Y.J.
Author_Institution :
Lab. of Biosensing & MicroMechatronics, Southwest Jiaotong Univ., Chengdu, China
Abstract :
The LOVE wave devices based on a number of composite structures have been designed and simulated in this paper for use as a bond-rupture biosensor. Bond-rupture biosensors use acoustic energy to probe the bond strength between the sensor substrate and the analyte. The sensitivity and displacement of LOVE wave sensors can be implemented due to energy concentration inside a guiding layer on the surface of a piezoelectric crystal. The choice of substrate and guiding layer material is the critical basic elements in the proper design of a LOVE wave biosensor applications. Finite element method (FEM) is a suitable numerical method to analyze and design the LOVE wave device. A 3-D FEM model has been created and defined to simulate the displacement response of the acoustic wave system. The LOVE wave can be clearly observed, and the total surface displacement can reach a value of 10-11m, which can easily induce the bond rupture between antibody and antigen. A 2-D model has been established to simulate the mass sensitivity with different composite structures of 128° YX LiNbO3, 36° YX LiTaO3, ST-quartz-PMMA and 128° YX LiNbO3, and 36° YX LiTaO3 and ST-quartz-SiO2. These results indicate that the 128° YX LiNbO3PMMA is the most suitable for bond rupture biosensors due to its high sensitivity and maximum displacement on the surface of piezoelectric crystal.
Keywords :
Love waves; biosensors; bonds (chemical); finite element analysis; fracture; mass measurement; molecular biophysics; piezoelectric devices; proteins; quartz crystal microbalances; surface acoustic wave sensors; 2-D model; 3D FEM model; LOVE wave biosensor applications; LOVE wave sensor device; ST quartz PMMA; acoustic energy; acoustic wave system; antibody; antigen; bond rupture biosensor; bond strength; composite structure; energy concentration; finite element method; guiding layer material; mass sensitivity; mass sensitivity device design; mass sensitivity evaluation; numerical method; piezoelectric crystal; sensor substrate material; surface displacement response; Biosensors; Load modeling; Sensitivity; Solid modeling; Substrates; Surface acoustic waves; Bond rupture; LOVE surface acoustic wave; finite element method; mass loading; sensitivity;
Journal_Title :
Sensors Journal, IEEE
DOI :
10.1109/JSEN.2014.2312414