DocumentCode
420112
Title
A precision micromachining technique for the fabrication of hybrid millimeter wave circuits and sub-assemblies
Author
Chow, W.H. ; Champion, A. ; Steenson, D.P.
Author_Institution
Inst. of Microwaves & Photonics, Leeds Univ., UK
Volume
1
fYear
2004
fDate
6-11 June 2004
Firstpage
345
Abstract
A high precision and cost effective micromachining technique has been developed to produce a range of complex waveguide components. These components are fabricated using the negative photoresist SU-8, and have high dimensional accuracy and an excellent surface quality. The technique is ideal for the straightforward production of low cost millimeter and submillimeter wave circuits and complex integrated subsystems with high electrical performance. Device integration is straightforward and measurements are presented for various compact hybrid circuits up to 325 GHz. The approach is suited for mass production and is able to exploit the strength of both the planar and 3-D circuits.
Keywords
assembling; hybrid integrated circuits; micromachining; microwave integrated circuits; millimetre wave circuits; millimetre wave integrated circuits; photoresists; waveguide components; 3D circuits; SU-8; compact hybrid circuits; complex integrated subsystems; complex waveguide components; cost effective micromachining; device integration; high dimensional accuracy; high electrical performance; hybrid integrated circuits; hybrid millimeter wave circuits; mass production; millimeter wave waveguides; negative photoresist; planar circuits; precision micromachining; submillimeter wave waveguides; surface quality; Costs; Fabrication; Micromachining; Millimeter wave circuits; Millimeter wave devices; Millimeter wave technology; Production; Resists; Submillimeter wave circuits; Waveguide components;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 2004 IEEE MTT-S International
ISSN
0149-645X
Print_ISBN
0-7803-8331-1
Type
conf
DOI
10.1109/MWSYM.2004.1335891
Filename
1335891
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