Title :
Opportunities and challenges in asymmetric device implementation [CMOS device scaling]
Author :
Buller, J.F. ; vanBentum, R. ; Cheek, J. ; Ehrichs, E. ; Horstmann, M. ; Searles, S.
Author_Institution :
Adv. Micro Devices Inc., Austin, TX, USA
Abstract :
Gate length (LGATE) scaling to reduce CMOS delay is becoming problematic due to high gate currents from thin gate dielectrics, process induced LGATE variation, and high channel dopings that reduce carrier mobility. These issues have led to tailoring of transistor architecture components and a "multiple everything" approach (e.g. multiple oxides, multiple threshold voltages) for both digital and analog circuit elements. Higher mobility transistor structures are desirable because transistor delay can be reduced without the penalties of gate current or LGATE variation. Individual tailoring of source and drain is an area where further gains can be realized, and is the subject of this work. Transistors with asymmetric halo have been developed and, for the first time to our knowledge, implemented in a highly complex, seventh generation microprocessor with >107 transistors. Opportunities and challenges for both digital and analog design with asymmetric transistors are explored.
Keywords :
MOSFET; carrier mobility; doping profiles; microprocessor chips; 130 nm; CMOS device scaling; asymmetric channel doping; asymmetric device implementation; asymmetric halo transistors; carrier mobility; drain tailoring; gate current variation; gate length scaling; gate length variation; high mobility transistor structures; microprocessor; multiple oxides; multiple threshold voltages; source tailoring; thin gate dielectrics; transistor delay reduction; CMOS process; Circuit testing; Delay; Doping; Electronic design automation and methodology; Implants; Intrusion detection; Microprocessors; Threshold voltage; Transistors;
Conference_Titel :
Custom Integrated Circuits Conference, 2004. Proceedings of the IEEE 2004
Print_ISBN :
0-7803-8495-4
DOI :
10.1109/CICC.2004.1358784