• DocumentCode
    4223
  • Title

    Forward to the Special Section on “Reliability of High-Mobility Channel Materials”

  • Author

    Crupi, Felice ; Kaczer, Ben ; Takagi, Shinichi

  • Author_Institution
    University of Calabria, Rende, Italy
  • Volume
    13
  • Issue
    4
  • fYear
    2013
  • fDate
    Dec. 2013
  • Firstpage
    428
  • Lastpage
    428
  • Abstract
    The ten papers in this special section are broken into two groups. The first group of six papers discusses the impact of different types of charge traps in the gate oxide or at its interface with the channel semiconductor on the performance, reliability and variability of high-mobility channel devices. The second group of four papers focuses specifically on BTI in high-mobility devices, suggesting that BTI is the main reliability issue not only in silicon devices but also in these new materials.
  • Keywords
    Dielectrics; HEMTs; Indium gallium arsenide; MOS devices; MOSFET; Materials reliability; Special issues and sections;
  • fLanguage
    English
  • Journal_Title
    Device and Materials Reliability, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1530-4388
  • Type

    jour

  • DOI
    10.1109/TDMR.2013.2291312
  • Filename
    6677577