DocumentCode :
4223
Title :
Forward to the Special Section on “Reliability of High-Mobility Channel Materials”
Author :
Crupi, Felice ; Kaczer, Ben ; Takagi, Shinichi
Author_Institution :
University of Calabria, Rende, Italy
Volume :
13
Issue :
4
fYear :
2013
fDate :
Dec. 2013
Firstpage :
428
Lastpage :
428
Abstract :
The ten papers in this special section are broken into two groups. The first group of six papers discusses the impact of different types of charge traps in the gate oxide or at its interface with the channel semiconductor on the performance, reliability and variability of high-mobility channel devices. The second group of four papers focuses specifically on BTI in high-mobility devices, suggesting that BTI is the main reliability issue not only in silicon devices but also in these new materials.
Keywords :
Dielectrics; HEMTs; Indium gallium arsenide; MOS devices; MOSFET; Materials reliability; Special issues and sections;
fLanguage :
English
Journal_Title :
Device and Materials Reliability, IEEE Transactions on
Publisher :
ieee
ISSN :
1530-4388
Type :
jour
DOI :
10.1109/TDMR.2013.2291312
Filename :
6677577
Link To Document :
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