DocumentCode
4223
Title
Forward to the Special Section on “Reliability of High-Mobility Channel Materials”
Author
Crupi, Felice ; Kaczer, Ben ; Takagi, Shinichi
Author_Institution
University of Calabria, Rende, Italy
Volume
13
Issue
4
fYear
2013
fDate
Dec. 2013
Firstpage
428
Lastpage
428
Abstract
The ten papers in this special section are broken into two groups. The first group of six papers discusses the impact of different types of charge traps in the gate oxide or at its interface with the channel semiconductor on the performance, reliability and variability of high-mobility channel devices. The second group of four papers focuses specifically on BTI in high-mobility devices, suggesting that BTI is the main reliability issue not only in silicon devices but also in these new materials.
Keywords
Dielectrics; HEMTs; Indium gallium arsenide; MOS devices; MOSFET; Materials reliability; Special issues and sections;
fLanguage
English
Journal_Title
Device and Materials Reliability, IEEE Transactions on
Publisher
ieee
ISSN
1530-4388
Type
jour
DOI
10.1109/TDMR.2013.2291312
Filename
6677577
Link To Document