Title :
Packaging of highly integrated PLC components
Author :
Krabe, D. ; Heise, G. ; Zavrsnik, M. ; Dieckroeger, J. ; Gao, Zhan ; Schinke, Christopb ; Scheubeck, Manfred ; Kraeker, Tobias ; Krombholz, Bernd ; Baumann, Ingo
Author_Institution :
OpTun GmbH, Munich, Germany
Abstract :
We discuss the progress of packaging techniques for highly integrated planar lightwave circuit (PLC) devices. Examples of thermal effects and the integration of power monitors demonstrate interactions between building blocks and the environment.
Keywords :
integrated circuit packaging; integrated optoelectronics; thermo-optical effects; integrated planar lightwave circuit device; packaging technique; power monitors; thermal effects;
Conference_Titel :
Optical Fiber Communication Conference, 2004. OFC 2004
Conference_Location :
Los Angeles, CA, USA
Print_ISBN :
1-55752-772-5
