Title :
Enhancement of tolerance to MAIs by the synergistic effect between M-ary PAM and the chip-level receiver for optical CDMA systems
Author :
Miyazawa, Takaya ; Sasase, Iwao
Author_Institution :
Dept. of Inf. & Comput. Sci., Keio Univ., Yokohama, Japan
fDate :
29 Nov.-3 Dec. 2004
Abstract :
First, in order to increase the number of transmitted bits per pulse in an optical CDMA system, we consider an M-ary PAM coded system. However, when a correlator is applied in the receiver, the multiple access interferences (MAIs) with high intensities deteriorate the system performance significantly, even if the number of MAIs is small. Consequently, we propose an optical CDMA system with M-ary PAM in conjunction with the chip-level receiver by M-level threshold detection instead of a correlator. The proposed system can obtain a synergistic effect between the PAM and the chip-level receiver, in which the chip-level receiver reduces MAIs more compared with the correlator and the PAM has a larger number of transmitted bits per frame than on-off keying (OOK), and achieves higher tolerance to MAIs than the OOK-CDMA system with a chip-level receiver at the same bit rate and number of subscribers. We show that the proposed PAM-CDMA system with the chip-level receiver achieves better bit error probability than the OOK-CDMA system with the chip-level receiver.
Keywords :
code division multiple access; error statistics; light interference; optical communication; pulse amplitude modulation; M-ary PAM coded system; M-level threshold detection; MAI tolerance enhancement; PAM-CDMA system; bit error probability; chip-level receiver; multiple access interference; optical CDMA systems; receiver correlator; synergistic effect; transmitted bits per pulse; Correlators; High speed optical techniques; Multiaccess communication; Multiple access interference; Optical fiber networks; Optical modulation; Optical pulses; Optical receivers; Optical transmitters; Pulse modulation;
Conference_Titel :
Global Telecommunications Conference, 2004. GLOBECOM '04. IEEE
Print_ISBN :
0-7803-8794-5
DOI :
10.1109/GLOCOM.2004.1378316