DocumentCode
42427
Title
Parallel Circuit Simulation via Binary Link Formulations (PvB)
Author
Paul, Deleglise ; Nakhla, Michel S. ; Achar, Ramachandra ; Nakhla, Natalie M.
Author_Institution
Mentor Graphics Corp., Ottawa, ON, Canada
Volume
3
Issue
5
fYear
2013
fDate
May-13
Firstpage
768
Lastpage
782
Abstract
As circuit sizes increase, a means to improve the performance of simulations without sacrificing the accuracy of the results becomes increasingly essential. To achieve this goal, a new parallel algorithm is presented that allows modern multicore processors to be exploited to realize this performance improvement. These improvements are obtained without sacrificing accuracy or resorting to iterative techniques. The computational complexity of the new algorithm is compared with the previously published algorithms based on the domain decomposition (DD) technique. A mathematical proof is presented showing that in the case of the DD algorithm, the CPU cost per iteration as a function of the number of links L between partitions is in the order of O(L2), leading to poor scalability as the number of partitions increases. On the other hand, the proposed algorithm exhibits superior scalability as its complexity increases only in the order of O(L). This result has been verified numerically and the scalability of the proposed algorithm is demonstrated with several industrial examples.
Keywords
circuit simulation; computational complexity; iterative methods; multiprocessing systems; network analysis; parallel algorithms; DD technique; PvB; binary link formulations; computational complexity; domain decomposition technique; iterative techniques; mathematical proof; multicore processors; parallel algorithm; parallel circuit simulation; Circuit simulation; Integrated circuit modeling; Mathematical model; Partitioning algorithms; Scalability; Time domain analysis; Vectors; Binary links; Newton–Raphson iterations; SPICE; circuit simulation; cloud computing; companion form; distributed computing; domain decomposition; multicore; node tearing; parallel simulation; transient analysis;
fLanguage
English
Journal_Title
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
2156-3950
Type
jour
DOI
10.1109/TCPMT.2012.2237228
Filename
6449301
Link To Document