DocumentCode :
42549
Title :
A Compiler Design Technique for Impulsive VDD Current Minimization
Author :
Shih-Yi Yuan ; Wei-Bing Su ; Guo-Kai Ni ; Ting-Yun Chi ; Sy-Yen Kuo
Author_Institution :
Dept. of Commun. Eng., Fang Chia Univ., Taichung, Taiwan
Volume :
55
Issue :
5
fYear :
2013
fDate :
Oct. 2013
Firstpage :
855
Lastpage :
866
Abstract :
For electromagnet interference (EMI) optimization issues, different hardware-level techniques have been proposed. This paper focuses on an EMI optimization technique via a software-level technique. We propose a novel estimation and optimization tool for reducing conducted EMI at specified frequency by compiler technology. This study is not a research on compiler technique but an adaption of computer science-domain technology to EMI optimization research. The proposed tool can accept C language syntax and generate many versions of assembly programs. These assembly programs perform the same functionality defined by the input C program but with different conducted EMI behaviors when they are executed. The proposed tool can estimate, select, and generate the assembly program with the least amount of conducted EMI released during its execution. The experiment results show that the proposed tool can analyze test C-programs and generate lower EMI assembly programs. Currently, compared to a commercial compiler, the proposed technique can decrease conducted EMI by 2-5 dB at any specified frequency.
Keywords :
C language; electromagnetic compatibility; electromagnetic interference; optimisation; optimising compilers; program assemblers; C language syntax; EMI behaviors; EMI optimization issues; assembly programs; compiler design technique; computer science-domain technology; conducted EMI; electromagnet interference; hardware-level techniques; impulsive VDD current minimization; software-level technique; Assembly; Databases; Electromagnetic interference; Generators; Grammar; Microcontrollers; Optimization; Electromagnetic analysis; electromagnetic interference (EMI); electromagnetic measurements;
fLanguage :
English
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9375
Type :
jour
DOI :
10.1109/TEMC.2013.2240459
Filename :
6449312
Link To Document :
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