DocumentCode
425738
Title
What do you mean by board test stinks?
Author
Smith, Michael J.
Author_Institution
Teradyne Inc., North Reading, MA, USA
fYear
2004
fDate
26-28 Oct. 2004
Firstpage
1427
Abstract
In printed circuit board manufacturing we have generally talked in terms of yield at the end of the manufacturing line. But as the yields has improved over the last 10-15 years from the mid 80´s to the high 90´s yield has become lest relevant and a real measure of quality of the end product become increasingly important. In-circuit test, which is primarily an electrical test system is still trying to find electrical faults but has focused more on finding manufacturing faults. Automatic optical inspection and automatic X-ray inspection has also supplemented in-circuit test.
Keywords
X-ray applications; automatic optical inspection; electrical faults; integrated circuit testing; printed circuit testing; automatic X-ray inspection; automatic optical inspection; board test stinks; electrical faults; electrical test system; in-circuit test; manufacturing faults; printed circuit board manufacturing; Automatic optical inspection; Automatic testing; Capacitors; Circuit faults; Circuit testing; Fault detection; Manufacturing; Packaging; Printed circuits; System testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference, 2004. Proceedings. ITC 2004. International
Print_ISBN
0-7803-8580-2
Type
conf
DOI
10.1109/TEST.2004.1387435
Filename
1387435
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