Global failure localization: we have to, but on what and how?

Failure analysis (FA) is important in knowing exactly what´s wrong with the ICs and what customers demand to know why. This work discusses how to do FA in the future, and where to perform this analysis. The need to examine transistors and interconnects from an IC´s backside has enabled a natural extension of front side optical FA techniques and development of new tools provide improved detection of diffusion defects. Diagnosis and FA must be considered and developed concurrently with new technologies. And this really answers how we´ll get to future FA.