Title :
Can nanoindentation help to determine the local mechanical properties of microelectronic materials? a state-of-the-art review
Author :
Albrecht, H.J. ; Hannach, T. ; Häse, A. ; Juritza, A. ; Müller, K. ; Müller, Wolfgang H.
Author_Institution :
Siemens AG, Berlin, Germany
Abstract :
We investigate the mechanical properties of intermetallic phases in microelectronic structures with the help of nanoindentation. Moreover, we shall try to answer the question as to whether nanoindentation can be used to quantify the growth of intermetallic phases, at least at the interface of a solder connection. Different specimens and treatments (such as reflow processes and subsequent aging) have been analyzed. The results of these experiments serve as reference values for FE-simulations which are also discussed.
Keywords :
ageing; indentation; mechanical testing; nanotechnology; reflow soldering; solders; FE-simulations; aging; intermetallic phase growth; intermetallic phases; local mechanical properties; microelectronic materials; microelectronic structures; nanoindentation; reflow process; solder connection interface; Copper; Finite element methods; Force control; Intermetallic; Lead; Material properties; Measurement techniques; Mechanical factors; Microelectronics; Testing;
Conference_Titel :
Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th
Print_ISBN :
0-7803-8821-6
DOI :
10.1109/EPTC.2004.1396652
