Can nanoindentation help to determine the local mechanical properties of microelectronic materials? a state-of-the-art review

Author

Albrecht, H.J. ; Hannach, T. ; Häse, A. ; Juritza, A. ; Müller, K. ; Müller, Wolfgang H.

Author_Institution

Siemens AG, Berlin, Germany

fYear

2004

fDate

8-10 Dec. 2004

Firstpage

462

Lastpage

467

Abstract

We investigate the mechanical properties of intermetallic phases in microelectronic structures with the help of nanoindentation. Moreover, we shall try to answer the question as to whether nanoindentation can be used to quantify the growth of intermetallic phases, at least at the interface of a solder connection. Different specimens and treatments (such as reflow processes and subsequent aging) have been analyzed. The results of these experiments serve as reference values for FE-simulations which are also discussed.

Keywords

ageing; indentation; mechanical testing; nanotechnology; reflow soldering; solders; FE-simulations; aging; intermetallic phase growth; intermetallic phases; local mechanical properties; microelectronic materials; microelectronic structures; nanoindentation; reflow process; solder connection interface; Copper; Finite element methods; Force control; Intermetallic; Lead; Material properties; Measurement techniques; Mechanical factors; Microelectronics; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th

Print_ISBN

0-7803-8821-6

Type

conf

DOI

10.1109/EPTC.2004.1396652

Filename

1396652