Title :
A study on the mechanical behavior of the sputtered nickel thin films for UBM applications
Author :
Sekhar, V.N. ; Srinivasarao, V. ; Jayaganthan, R. ; Mohankumar, K. ; Tay, A.A.O.
Author_Institution :
Nano-Microsystems Integration Lab., Singapore Nat. Univ., Singapore
Abstract :
Nickel films of different thicknesses of 0.5 and 0.8 μm were deposited by DC magnetron sputtering on the adhesion promoting Ta layer deposited on the silicon (100) wafer. The sputtering conditions used were 4 × 10-6 base pressure; 3 × 10-1 working pressure; 4 kW sputter power for 8 inch targets. The films were annealed in vacuum at temperature 200°C and their elastic modulus and hardness were measured by nanoindentation technique (hysitron triboscope). Different load rates were used when indenting the samples. The influence of thickness and annealing temperature on the mechanical behaviour of nickel thin films is explored in the present work.
Keywords :
annealing; elastic moduli measurement; hardness; indentation; nanotechnology; nickel; silicon; sputter deposition; thin films; 0.5 micron; 0.8 micron; 200 C; 4 kW; DC magnetron sputtering deposition; Ni; Si; UBM applications; adhesion promoting Ta layer; annealing temperature; elastic modulus measurement; film annealing; film thickness; hardness measurement; hysitron triboscope; mechanical behavior; nanoindentation technique; silicon 100 wafer; sputtered nickel thin films; Annealing; Grain size; Mechanical factors; Metallization; Nickel; Plastic films; Sputtering; Stress; Testing; Transistors;
Conference_Titel :
Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th
Print_ISBN :
0-7803-8821-6
DOI :
10.1109/EPTC.2004.1396680
