DocumentCode
428
Title
Broadband Complementary Metal-Oxide Semiconductor Interconnection Transmission Line Measurements With Generalized Probe Transition Characterization and Verification of Multiline Thru-Reflect-Line Calibration
Author
Chien-Chang Huang
Author_Institution
Dept. of Commun. Eng., Yuan Ze Univ., Taoyuan, Taiwan
Volume
3
Issue
9
fYear
2013
fDate
Sept. 2013
Firstpage
1564
Lastpage
1569
Abstract
This paper presents extraction techniques and measurement results for broadband complementary metal-oxide semiconductor (CMOS) interconnection transmission line (TL) measurements with generalized probe transition characterization and verification of multiline thru-reflect-line (TRL) calibration. Initially, the probe transition is represented by a transmission matrix instead of the conventional shunt/series model, with detailed parameter evaluation procedures using measured data from two lines that are twice in length. Subsequently, an additional long TL that fully exhibits the TL characteristics at low frequencies is characterized, whereas the matrix manipulations with the other two TL measured data are adapted for high-frequency regions to avoid the ill-conditioned problem. Consequently, broadband characterization for CMOS TL is achieved in a cost-effective manner. With an additional reflect test structure, the multiline TRL calibration can be performed as well for verification. The proposed method is examined by thin-film microstrip lines using CMOS 90-nm one-poly/nine-metal technology with measurement frequencies from 2 to 110 GHz.
Keywords
CMOS integrated circuits; calibration; integrated circuit interconnections; microstrip lines; thin films; transmission lines; CMOS interconnection transmission line; TRL calibration; broadband complementary metal-oxide semiconductor interconnection transmission line measurements; generalized probe transition characterization; generalized probe transition verification; multiline thru-reflect-line calibration; thin film microstrip lines; CMOS integrated circuits; Calibration; Frequency measurement; Probes; Semiconductor device measurement; Transmission line matrix methods; Transmission line measurements; Calibration; interconnections; scattering parameters measurement; transmission lines;
fLanguage
English
Journal_Title
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
2156-3950
Type
jour
DOI
10.1109/TCPMT.2012.2228897
Filename
6403885
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