• DocumentCode
    428
  • Title

    Broadband Complementary Metal-Oxide Semiconductor Interconnection Transmission Line Measurements With Generalized Probe Transition Characterization and Verification of Multiline Thru-Reflect-Line Calibration

  • Author

    Chien-Chang Huang

  • Author_Institution
    Dept. of Commun. Eng., Yuan Ze Univ., Taoyuan, Taiwan
  • Volume
    3
  • Issue
    9
  • fYear
    2013
  • fDate
    Sept. 2013
  • Firstpage
    1564
  • Lastpage
    1569
  • Abstract
    This paper presents extraction techniques and measurement results for broadband complementary metal-oxide semiconductor (CMOS) interconnection transmission line (TL) measurements with generalized probe transition characterization and verification of multiline thru-reflect-line (TRL) calibration. Initially, the probe transition is represented by a transmission matrix instead of the conventional shunt/series model, with detailed parameter evaluation procedures using measured data from two lines that are twice in length. Subsequently, an additional long TL that fully exhibits the TL characteristics at low frequencies is characterized, whereas the matrix manipulations with the other two TL measured data are adapted for high-frequency regions to avoid the ill-conditioned problem. Consequently, broadband characterization for CMOS TL is achieved in a cost-effective manner. With an additional reflect test structure, the multiline TRL calibration can be performed as well for verification. The proposed method is examined by thin-film microstrip lines using CMOS 90-nm one-poly/nine-metal technology with measurement frequencies from 2 to 110 GHz.
  • Keywords
    CMOS integrated circuits; calibration; integrated circuit interconnections; microstrip lines; thin films; transmission lines; CMOS interconnection transmission line; TRL calibration; broadband complementary metal-oxide semiconductor interconnection transmission line measurements; generalized probe transition characterization; generalized probe transition verification; multiline thru-reflect-line calibration; thin film microstrip lines; CMOS integrated circuits; Calibration; Frequency measurement; Probes; Semiconductor device measurement; Transmission line matrix methods; Transmission line measurements; Calibration; interconnections; scattering parameters measurement; transmission lines;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    2156-3950
  • Type

    jour

  • DOI
    10.1109/TCPMT.2012.2228897
  • Filename
    6403885