A new system for reducing the bonding process cycle time and increasing the accuracy of bonding diagram

The high intensity semiconductor requires tight collaboration between design and manufacturing not only to reduce the total throughput time from product development to manufacturing, but also to improve the quality. Especially the bonding process of packaging has become more sophisticated and critical to make final products. Therefore the bonding process is systemized to improve the productivity and yields. It automatically checks and removes errors of the drawings with the predefined check rules and by simulating the real process of the wire bonder. Final results of drawing standards are conveyed to the real bonding equipment.