• DocumentCode
    428920
  • Title

    Nanoscopic inclusions in high-deposition-rate a-Si:H

  • Author

    Brinza, Monica ; Emelianova, Evguenia V.

  • Author_Institution
    Laboratorium voor Halfgeleiderfysica, Leuven Univ., Germany
  • Volume
    1
  • fYear
    2004
  • fDate
    4-6 Oct. 2004
  • Lastpage
    76
  • Abstract
    Hole drift mobility measured in a-Si:H deposited by expanding thermal plasma method at growth rates higher than 2nm/s fails to show the electric field dependence normally seen in the case of dispersive transport in ´standard´ a-Si:H, i.e. material prepared by plasma-enhanced chemical vapor deposition at ∼250°C. A Gaussian component in the density of valence-band tail states, superimposed to the generally accepted exponential one, can account for such behavior for the hole transients. The presence of randomly sized nanocrystallites in the amorphous matrix is thought to generate the Gaussian density of states contribution.
  • Keywords
    amorphous semiconductors; crystallites; hole mobility; hydrogen; hydrogenation; inclusions; nanostructured materials; plasma CVD; silicon; Gaussian component; Gaussian density; Si:H; amorphous matrix; dispersive transport; electric field dependence; hole drift mobility; hole transients; material preparation; nanocrystallites; nanoscopic inclusions; plasma-enhanced chemical vapor deposition; thermal plasma method; valence-band tail states; Chemical vapor deposition; Dispersion; Electric variables measurement; Measurement standards; Plasma chemistry; Plasma density; Plasma materials processing; Plasma measurements; Plasma transport processes; Thermal expansion;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Conference, 2004. CAS 2004 Proceedings. 2004 International
  • Print_ISBN
    0-7803-8499-7
  • Type

    conf

  • DOI
    10.1109/SMICND.2004.1402807
  • Filename
    1402807