DocumentCode
428928
Title
3D MEMS circuits integration for RF and millimeter wave communications
Author
Dubuc, D. ; Grenier, K. ; Do, M.N. ; Busquère, J.P. ; Coustou, A. ; Ducarouge, B. ; Melle, S. ; Mazenq, L. ; Bouchriha, F. ; Pons, P. ; Plana, R.
Author_Institution
P. Sabatier Univ., Toulouse, France
Volume
1
fYear
2004
fDate
4-6 Oct. 2004
Lastpage
128
Abstract
This paper presents the 3D integration concept of RF and millimeterwave circuits through the use of MEMS technologies. Silicon based Microsystems can then be developed and feature high performances thanks to the evolution of the SiGe and MEMS technologies and high compactness due to a 3D integration.
Keywords
elemental semiconductors; micromechanical devices; millimetre wave circuits; radiofrequency integrated circuits; silicon compounds; 3D circuit integration; MEMS; RF circuits; RF communications; SiGe; millimeterwave circuits; millimeterwave communications; silicon-based Microsystems; Active inductors; Digital circuits; Germanium silicon alloys; Integrated circuit technology; MIM capacitors; Microelectromechanical devices; Micromechanical devices; Packaging; Radio frequency; Silicon germanium;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Conference, 2004. CAS 2004 Proceedings. 2004 International
Print_ISBN
0-7803-8499-7
Type
conf
DOI
10.1109/SMICND.2004.1402820
Filename
1402820
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