Title :
Immunogold labeling to enhance contrast in optical coherence microscopy of tissue engineered corneal constructs
Author :
Raub, C.B. ; Orwin, E.J. ; Haskell, R.
Author_Institution :
Dept. of Biol., Harvey Mudd Coll., Claremont, CA, USA
Abstract :
Our lab has used an optical coherence microscope (OCM) to assess both the structure of tissue-engineered corneal constructs and their transparency. Currently, we are not able to resolve cells versus collagen matrix material in the images produced. We would like to distinguish cells in order to determine if they are viable while growing in culture and also if they are significantly contributing to the light scattering in the tissue. In order to do this, we are currently investigating the use of immunogold labeling. Gold nanoparticles are high scatterers and can create contrast in images. We have conjugated gold nanoparticles to antibodies specific to the α5β1 integrins expressed in some corneal cells. This choice of target should allow assessment of the phenotypic behavior of the cells in the tissue, as different integrins are expressed in different phenotypes. This study applies the immunogold technique to study cultured corneal cells using the OCM with the ultimate goal of monitoring cellular behavior in engineered tissue and corroborating results from standard histological methods.
Keywords :
bio-optics; biological tissues; cellular biophysics; eye; gold; molecular biophysics; nanoparticles; optical microscopy; proteins; tissue engineering; Au; cell culture; collagen matrix material; corneal cells; gold nanoparticles; immunogold labeling technique; light scattering; optical coherence microscope; tissue-engineered cornea; Biological materials; Cells (biology); Gold; Image resolution; Labeling; Light scattering; Nanoparticles; Optical materials; Optical microscopy; Optical scattering; Cornea; optical coherence microscopy; tissue engineering;
Conference_Titel :
Engineering in Medicine and Biology Society, 2004. IEMBS '04. 26th Annual International Conference of the IEEE
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-8439-3
DOI :
10.1109/IEMBS.2004.1403386