• DocumentCode
    429367
  • Title

    Neural recording chip with penetrating Si microprobe electrode array by selective vapor-liquid-solid growth method

  • Author

    Kawano, Takeshi ; Takao, Hidekuni ; Sawada, Kazuaki ; Ishida, Makoto

  • Author_Institution
    Dept. of Electr. & Electr. Eng., Toyohashi Univ. of Technol., Japan
  • Volume
    1
  • fYear
    2004
  • fDate
    1-5 Sept. 2004
  • Firstpage
    2066
  • Lastpage
    2069
  • Abstract
    This paper reports on the development of neural recording chip device with penetrating Si microprobe electrode array using IC-process. The Si microprobe electrode array each with a few microns in diameter was grown at predetermined positions with interconnection-wirings. Controlling the diameter and the length of Si probes can be realized by a selective vapor-liquid-solid (VLS) growth. In this work, Si probes with 2 μm in diameter and 60 μ in length were fabricated, which were conductive-Si probes and they were encapsulated with SiO2 layers. To reduce the impedance of Si probes, the tips of Si probes were coated with a metal Au layer. As a result, penetrating Si microprobes measured in saline solution, showed impedance of the order of 300 k to 500 kω at 1 kHz. Packaging techniques for the probe chip were performed with a fluid-tight chamber and a flexible-printed-circuit of polyimide for neural recording experiments.
  • Keywords
    biomedical measurement; chip scale packaging; encapsulation; integrated circuits; microelectrodes; micromechanical devices; neurophysiology; silicon; 1 kHz; Si; flexible-printed-circuit; fluid-tight chamber; neural recording chip; packaging techniques; penetrating Si microprobe electrode array; polyimide; selective vapor-liquid-solid growth method; Electrodes; Fabrication; Gold; Impedance; Integrated circuit interconnections; Microelectrodes; Nervous system; Neurons; Probes; Wiring; IC process; Microelectrode; neural recording; vapor-liquid-solid Si growth method;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 2004. IEMBS '04. 26th Annual International Conference of the IEEE
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    0-7803-8439-3
  • Type

    conf

  • DOI
    10.1109/IEMBS.2004.1403607
  • Filename
    1403607