Title :
On-chip cooling of RFICs and MICs
Author :
Liu, Wai Y. ; Virdee, Bal S.
Keywords :
Annealing; Cooling; Fabrication; Integrated circuit technology; Microwave integrated circuits; Packaging; Polymers; Radiofrequency integrated circuits; Resins; Temperature;
Conference_Titel :
Microwave Conference, 2004. 34th European
Conference_Location :
Amsterdam, The Netherlands
Print_ISBN :
1-58053-992-0