A 1-watt ku-band power amplifier MMIC using cost-effective organic SMD package

Author

Bessemoulin, A. ; Parisot, M. ; Quentin, P. ; Saboureau, C. ; van Heijningen, M. ; Priday, J.

Volume

fYear

2004

fDate

14-14 Oct. 2004

Firstpage

349

Lastpage

352

Keywords

Assembly; Copper; Costs; Electronics packaging; High power amplifiers; MMICs; Microwave devices; Power amplifiers; Substrates; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Conference, 2004. 34th European

Conference_Location

Amsterdam, The Netherlands

Print_ISBN

1-58053-992-0

Type

Filename

1412594

Link To Document