Title :
A 1-watt ku-band power amplifier MMIC using cost-effective organic SMD package
Author :
Bessemoulin, A. ; Parisot, M. ; Quentin, P. ; Saboureau, C. ; van Heijningen, M. ; Priday, J.
Keywords :
Assembly; Copper; Costs; Electronics packaging; High power amplifiers; MMICs; Microwave devices; Power amplifiers; Substrates; Thermal resistance;
Conference_Titel :
Microwave Conference, 2004. 34th European
Conference_Location :
Amsterdam, The Netherlands
Print_ISBN :
1-58053-992-0
