DocumentCode :
430584
Title :
Millimetre-wave MMIC packaging compatible with surface-mount technology (SMT)
Author :
Galière, J. ; Valard, J.L. ; Estèbe, E.
Volume :
1
fYear :
2004
fDate :
14-14 Oct. 2004
Firstpage :
353
Lastpage :
355
Keywords :
Assembly; Capacitors; Chip scale packaging; Costs; Integrated circuit interconnections; Lamination; Liquid crystal polymers; MMICs; Substrates; Surface-mount technology;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Conference, 2004. 34th European
Conference_Location :
Amsterdam, The Netherlands
Print_ISBN :
1-58053-992-0
Type :
conf
Filename :
1412595
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=430584
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