Title :
Novel organic SMD package for high-power millimeter wave MMICs
Author :
van Heijningen, M. ; Priday, J.
Keywords :
Bonding; Circuit simulation; Electromagnetic heating; Insertion loss; MMICs; Packaging; Probes; Radio frequency; Testing; Thermal resistance;
Conference_Titel :
Microwave Conference, 2004. 34th European
Conference_Location :
Amsterdam, The Netherlands
Print_ISBN :
1-58053-992-0
