• DocumentCode
    432132
  • Title

    CMUTs with dual electrode structure for improved transmit and receive performance

  • Author

    McLean, Jeff ; Guldiken, Rasim O. ; Degertekin, F. Levent

  • Author_Institution
    George W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • Volume
    1
  • fYear
    2004
  • fDate
    23-27 Aug. 2004
  • Firstpage
    501
  • Abstract
    We report on the use of a dual electrode structure to improve the performance of capacitive micromachined ultrasonic transducers (CMUTs.). In the dual electrode structure, separate transmit and receive electrodes are embedded either in the same CMUT membrane or in the dielectric substrate beneath the same membrane. This configuration has several advantages. First, the maximum pressure amplitude during transmit mode can be significantly increased by locating the transmit electrodes near the edges of the membrane. In this case, leveraged bending increases the maximum displacement without collapsing the membrane. Second, since the DC bias of the electrodes can be controlled independently, the device capacitance can be increased during the receive time by biasing both receive and transmit electrodes. Additionally, separate electronics can be used for transmit and receive without the need for a switch. We have fabricated a 0.3×0.65 mm2 CMUT element consisting of 20 μm wide, 100 μm long and 0.9 μm thick rectangular silicon nitride membranes. The transmit electrodes are 4 μm wide and located at the edges of the membrane, whereas the 8 μm wide receive electrode is at the center. With this non-optimized structure, we measured a 6.8 dB increase in maximum output pressure at 9 MHz with side electrode excitation. We also demonstrated the possibility of using dual electrodes for simultaneous excitation and detection of several CMUT membrane vibration modes.
  • Keywords
    capacitive sensors; electrodes; membranes; microsensors; substrates; ultrasonic transducers; 0.3 mm; 0.65 mm; 0.9 to 20 micron; 9 MHz; CMUT membrane vibration modes; DC bias; SiN; capacitive micromachined ultrasonic transducers; capacitive transducers; dielectric substrate; dual electrode structure; leveraged bending; pressure amplitude; receive electrodes; silicon nitride membranes; transmit electrodes; Biomembranes; Capacitance; Dielectric substrates; Electrodes; Finite element methods; Mechanical engineering; Silicon; Switches; Ultrasonic transducers; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 2004 IEEE
  • ISSN
    1051-0117
  • Print_ISBN
    0-7803-8412-1
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2004.1417772
  • Filename
    1417772