• DocumentCode
    432247
  • Title

    Ferroelectrets: highly anisotropic electrically charged polymer foams for electromechanical transducer applications

  • Author

    Wegener, M. ; Tuncer, E. ; Wirges, W. ; Gerhard-Multhaupt, R. ; Dansachmüller, M. ; Bauer-Gogonea, S. ; Schwödiauer, R. ; Bauer, S.

  • Author_Institution
    Dept. of Phys., Univ. of Potsdam, Germany
  • Volume
    2
  • fYear
    2004
  • fDate
    23-27 Aug. 2004
  • Firstpage
    1138
  • Abstract
    Charged polymer foams show ferroelectret behavior. The anisotropy of the foamed structure can be controlled by gas-diffusion expansion. By means of well-designed void-inflation processes, the resulting dipole size is varied over a broad range. This also changes the mechanical properties, and ferroelectret foams with elastic moduli between 1 and 15 MPa can be prepared. Cellular polypropylene foams with transducer coefficients from 15 to around 500 pC/N, electromechanical coupling factors between 0.02 and 0.1 and thickness-extension resonance frequencies from 500 kHz to 2 MHz were achieved. Therefore, inflation is a suitable tool for the optimization of electromechanical transducer properties. We discuss the preparation and characterization of cellular ferroelectretic polypropylene foams as well as first steps for modeling the mechanical properties of anisotropic foams.
  • Keywords
    anisotropic media; electromechanical effects; polymer foams; ultrasonic transducers; anisotropic electrically charged polymer foams; cellular polypropylene foams; dipole size; electromechanical coupling factors; electromechanical transducer; ferroelectrets; gas-diffusion expansion; mechanical properties; thickness-extension resonance frequencies; transducer coefficients; void-inflation processes; Anisotropic magnetoresistance; Biological materials; Electrets; Mechanical factors; Physics; Piezoelectric transducers; Piezoelectricity; Polymer foams; Resonance; Resonant frequency;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 2004 IEEE
  • ISSN
    1051-0117
  • Print_ISBN
    0-7803-8412-1
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2004.1417981
  • Filename
    1417981