DocumentCode :
432278
Title :
Temperature compensated LiTaO3/sapphire bonded SAW substrate with low loss and high coupling factor suitable for US-PCS application
Author :
Miura, M. ; Matsuda, T. ; Satoh, Y. ; Ueda, M. ; Ikata, O. ; Ebata, Y. ; Takagi, H.
Author_Institution :
Fujitsu Labs. Ltd., Hyogo, Japan
Volume :
2
fYear :
2004
fDate :
23-27 Aug. 2004
Firstpage :
1322
Abstract :
A novel temperature-compensated SAW substrate was developed based on bonded LiTaO3/sapphire. Because of its small TEC (thermal expansion coefficient) and large Young´s modulus, sapphire is an ideal material for a support substrate. The frequency and temperature characteristics of the bonded LiTaO3/sapphire SAW substrate and its application to a US-PCS duplexer are described.
Keywords :
compensation; mobile handsets; personal communication networks; sapphire; substrates; surface acoustic wave filters; LiTaO3; SAW filters; US-PCS duplexer; Young´s modulus; coupling factor; lithium tantalate/sapphire bonded SAW substrate; mobile phones; temperature-compensated SAW substrate; thermal expansion coefficient; Bonding; Degradation; Frequency; Glass; Personal communication networks; Propagation losses; SAW filters; Surface acoustic waves; Temperature; Thermal expansion;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics Symposium, 2004 IEEE
ISSN :
1051-0117
Print_ISBN :
0-7803-8412-1
Type :
conf
DOI :
10.1109/ULTSYM.2004.1418036
Filename :
1418036
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=432278
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