High-performance low-cost embedded inductors using thin array plastic packaging (TAPP) for RF/microwave applications

We report the first demonstration of high-Q embedded inductors fabricated using a thin-array-plasticpackaging (TAPPTM) technology. The TAPP technology provides a platform that integrates digital, analog, RF integrated circuits, along with high-performance passive components for system-in-package implementation. Embedded inductors ranging from 14- to 300- nH were fabricated. All the inductors with inductance less than 100 nH exhibit self-resonant frequency above 1 GHz. For a 14 nH inductor, Q factor of 35 was achieved at 1.6 GHz and the selfresonant frequency was measured at 6.15 GHz, comparable to the performance of state-of-the-art discrete chip inductors.