Title :
Multi-layer stubs in LTCC technology
Author :
Panther, A. ; Stubbs, M.G. ; Kautio, K.
Abstract :
Multi-layer structures using multiple conductor layers in LTCC technology are examined for use as microwave stubs. Novel, multi-layer stubs are designed and tested for both microstrip and coplanar systems. Circuit models of multi-layer stubs are presented snd compared with measured data and a bandstop fdter using multi-layer stubs is presented to demonstrate application of the concept.
Keywords :
Ceramics; Conductors; Flexible printed circuits; Frequency; Impedance; Microstrip; Microwave circuits; Microwave technology; Packaging; Passive circuits;
Conference_Titel :
Microwave Conference, 2004. 34th European
Conference_Location :
Amsterdam, The Netherlands
Print_ISBN :
1-58053-992-0
