Title :
Dispersion analysis of packaged MMIC amplifiers using the compression approach
Author :
Lesage, J.-M. ; Loison, R. ; Gillard, R. ; Barbier, T. ; Mancuso, Y.
Abstract :
This paper presents the study of packaging effects on MMIC amplifiers using a global EM simulation based on the compression approach. On-wafer measurements are used as MMIC models and a single EM simulation is performed in order to describe their environment. The compression approach pennits to efficiently simulate all chip combinations and thus to perform a dispersion analysis of the packaged MMICs.
Keywords :
Analytical models; Calibration; Circuit simulation; Electromagnetic measurements; Electronics packaging; MMICs; Microwave technology; Performance analysis; Performance evaluation; Semiconductor device measurement;
Conference_Titel :
Microwave Conference, 2004. 34th European
Conference_Location :
Amsterdam, The Netherlands
Print_ISBN :
1-58053-992-0
