DocumentCode
432585
Title
A microstrip-to-microstrip hot-via transition up-to 80 GHz designed for direct PCB mounting of MMICs
Author
Saboureau, C. ; Baillargeat, Dominique ; Verdeyme, S. ; Bessemoulin, A. ; Bois, J.-R. ; Quentin, P.
Volume
2
fYear
2004
fDate
12-14 Oct. 2004
Firstpage
653
Lastpage
656
Abstract
This paper presents a new microstrip-tomicrostrip Hot-Via transition designed for SMD MMICs mounted on a PCB carrier substrate. Good RF performance is achieved from DC to 80 GHz which demonstrates the potential of the Hot-Via concept. The broadband transition optimized is generic and can he adapted on a large panel of MMICs.
Keywords
Assembly; Chip scale packaging; Coplanar transmission lines; Costs; Integrated circuit interconnections; MMICs; Microstrip; Microwave devices; Radio frequency; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference, 2004. 34th European
Conference_Location
Amsterdam, The Netherlands
Print_ISBN
1-58053-992-0
Type
conf
Filename
1418901
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