Conceptual structure for the integration of antennas with packaging technology

Next generation wireless communication systems and hand-held devices require the integration of system circuits, RF circuits and antennas. It is often desired to integrate these components into one single chip. However, the size of the antenna is bound to physical limitations. The specifications of the system often demand an antenna which is larger than the average chip size. Therefore, we look at the integration of the antenna within the package of the system and analyze the effects of this integration on the system´s operation. A volume-efficient solution was found, which is not prone to interference between the system and the antenna??s radiation.