DocumentCode
434402
Title
Modeling reconstruction of coupled transmission lines using time-domain characterization in high-speed digital system
Author
Liu, Huang Chieh ; Hsu, Show-Gwo ; Lee, Yu-Shu ; Chiu, Chien-Ching
Author_Institution
Dept. of Electr. Eng., Tamkang Univ. Tamsui, Taipei, Taiwan
Volume
1
fYear
2003
fDate
11-16 May 2003
Firstpage
304
Abstract
A novel method is developed to reconstruct the physically structures of a nonuniform couple transmission lines from layer peeling algorithm and genetic algorithm. Base on the time domain reflection (TDR) measurement, the impedance profile of the device under test (D.U.T) is first derived by layer peeling transmission line synthesis. Then, the genetic algorithm (G.A.) is employed to extract the parameter of the lumped/distributed circuits in high-speed digital circuit. As a result, the system characteristic can be easily obtained by the extracted model and SPICE circuit simulation software.
Keywords
coupled transmission lines; digital circuits; distributed parameter networks; genetic algorithms; high-speed integrated circuits; lumped parameter networks; time-domain analysis; SPICE circuit simulation software; coupled transmission line reconstruction; device under test; distributed circuit parameters; genetic algorithm; high-speed digital circuit; high-speed digital system; impedance profile; layer peeling algorithm; layer peeling transmission line synthesis; lumped circuit parameters; nonuniform couple transmission lines; time domain reflection measurement; time-domain characterization; Circuit testing; Couplings; Digital systems; Distributed parameter circuits; Genetic algorithms; Impedance measurement; Time domain analysis; Time measurement; Transmission line measurements; Transmission lines;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility, 2003. EMC '03. 2003 IEEE International Symposium on
Print_ISBN
0-7803-7779-6
Type
conf
DOI
10.1109/ICSMC2.2003.1428251
Filename
1428251
Link To Document