• DocumentCode
    434402
  • Title

    Modeling reconstruction of coupled transmission lines using time-domain characterization in high-speed digital system

  • Author

    Liu, Huang Chieh ; Hsu, Show-Gwo ; Lee, Yu-Shu ; Chiu, Chien-Ching

  • Author_Institution
    Dept. of Electr. Eng., Tamkang Univ. Tamsui, Taipei, Taiwan
  • Volume
    1
  • fYear
    2003
  • fDate
    11-16 May 2003
  • Firstpage
    304
  • Abstract
    A novel method is developed to reconstruct the physically structures of a nonuniform couple transmission lines from layer peeling algorithm and genetic algorithm. Base on the time domain reflection (TDR) measurement, the impedance profile of the device under test (D.U.T) is first derived by layer peeling transmission line synthesis. Then, the genetic algorithm (G.A.) is employed to extract the parameter of the lumped/distributed circuits in high-speed digital circuit. As a result, the system characteristic can be easily obtained by the extracted model and SPICE circuit simulation software.
  • Keywords
    coupled transmission lines; digital circuits; distributed parameter networks; genetic algorithms; high-speed integrated circuits; lumped parameter networks; time-domain analysis; SPICE circuit simulation software; coupled transmission line reconstruction; device under test; distributed circuit parameters; genetic algorithm; high-speed digital circuit; high-speed digital system; impedance profile; layer peeling algorithm; layer peeling transmission line synthesis; lumped circuit parameters; nonuniform couple transmission lines; time domain reflection measurement; time-domain characterization; Circuit testing; Couplings; Digital systems; Distributed parameter circuits; Genetic algorithms; Impedance measurement; Time domain analysis; Time measurement; Transmission line measurements; Transmission lines;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 2003. EMC '03. 2003 IEEE International Symposium on
  • Print_ISBN
    0-7803-7779-6
  • Type

    conf

  • DOI
    10.1109/ICSMC2.2003.1428251
  • Filename
    1428251