DocumentCode
434427
Title
Frequency prediction of maximum radiated emission due to ground-bounce from resonance resistances of PCB power-ground planes
Author
Nakamura, Kenji ; Alrijadjis ; Wang, Jianqing ; Fujiwara, Osamu
Author_Institution
Fac. of Eng., Nagoya Inst. of Technol.
Volume
1
fYear
2003
fDate
16-16 May 2003
Firstpage
475
Abstract
It is well-known that the frequencies of radiated peak emissions due to the ground bounce of a printed circuit board (PCB) are related to the resonance frequencies of the input impedance between the power and ground planes (PCB input impedance), while their correspondence relationship is unclear. In this paper, we investigated the quantitative relationship between the frequencies of peak emissions radiated from a PCB and the resonance resistances of the PCB impedance from measurement and finite-difference time-domain (FDTD) analysis. As a result, we found that the ratio of squared electric far-fields at the PCB resonance frequencies corresponds to the ratio of radiated resonance power. This finding leads to the conclusion that the radiated peak emission frequency can be predicted from PCB resonance resistances and the internal resistance of the PCB excitation source
Keywords
circuit resonance; electric field measurement; electric impedance; electric resistance measurement; finite difference time-domain analysis; printed circuits; PCB excitation source; PCB input impedance; PCB power-ground planes; PCB resonance frequencies; PCB resonance resistance; finite-difference time-domain analysis; frequency prediction; ground-bounce; internal resistance; maximum radiated emission; peak emission radiation; printed circuit board; radiated peak emission frequency; radiated peak emissions; radiated resonance power; squared electric far-fields; Electrical resistance measurement; Electronic mail; Finite difference methods; Frequency measurement; Impedance measurement; Power engineering and energy; Printed circuits; Resonance; Resonant frequency; Time domain analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility, 2003. EMC '03. 2003 IEEE International Symposium on
Conference_Location
Istanbul
Print_ISBN
0-7803-7779-6
Type
conf
DOI
10.1109/ICSMC2.2003.1428295
Filename
1428295
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