Thermal and structural properties of elastic epoxy for high voltage

Author

Lee, K.Y. ; Lee, K.W. ; Choi, Y.S. ; Park, D.H.

Author_Institution

Sch. of Electr. Electron. & Inf. Eng., Wonkwang Univ., Ihksan, South Korea

fYear

2004

fDate

23-26 May 2004

Firstpage

508

Lastpage

511

Abstract

Elastic factors of elastic epoxy were investigated by TMA (thermomechanical analysis), DMTA (dynamic mechanical thermal analysis), and FESEM (field emission scanning electron microscope) as toughness investigation to improve brittleness of existing epoxy resin. We made of specimens with the contents of 0 phr, 20 phr and 35 phr. The ranges of measurement temperature of the TMA and DMTA were changed from -20 °C to 200 °C. Glass transition temperature (Tg) of elastic epoxy was measured through thermal analysis equipment. Also, thermal expansion coefficient (α), modulus and loss factor were investigated through TMA, and DMTA. In addition, the structures of specimens were analyzed through FESEM, and then elastic factors of elastic epoxy were visually showed by FESEM. As thermal analysis results, 20 phr was more excellent than 35 phr thermally and mechanically. Specially, thermal expansion coefficient, modulus, and damping properties were excellent. By structure images analysis through FESEM, we found elastic factors of elastic epoxy that is not existing epoxy, and proved high impact.

Keywords

brittleness; damping; field emission electron microscopy; polymer structure; scanning electron microscopy; temperature measurement; thermal analysis; thermal expansion; -20 to 200 C; DMTA; FESEM; TMA; brittleness; damping property; dynamic mechanical thermal analysis; elastic epoxy resin; field emission scanning electron microscope; glass transition temperature; structural property; structure image analysis; temperature measurement; thermal expansion coefficient; thermal property; thermomechanical analysis; Electron emission; Epoxy resins; Glass; Scanning electron microscopy; Temperature distribution; Temperature measurement; Thermal expansion; Thermal factors; Thermomechanical processes; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Power Modulator Symposium, 2004 and 2004 High-Voltage Workshop. Conference Record of the Twenty-Sixth International

Print_ISBN

0-7803-8586-1

Type

conf

DOI

10.1109/MODSYM.2004.1433625

Filename

1433625