DocumentCode :
435512
Title :
Crosstalk evaluation: the influence of inductance and routing orientation
Author :
Deschacht, D. ; Lopez, A.
Author_Institution :
Lab. d´´Inf., CNRS, Montpellier, France
fYear :
2004
fDate :
6-8 Dec. 2004
Firstpage :
185
Lastpage :
188
Abstract :
Rapid progress in integrated circuit technology has led to an increase in the switching speed of the digital chip. As a result, there is a growing interest in the inductance associated with signal lines. In this paper, we show the influence of inductance and routing orientation on crosstalk voltage by considering two configurations of parallel coupled interconnects, one with both drivers on the same side, and the other with the drivers in opposite directions. For a typical DSM (deep-sub-micron) process, we show that when standard distributed RC models are used and inductive effects and routing orientation are ignored, large errors can occur in the prediction and evaluation of the crosstalk voltage: the discrepancy rates can reach a mean value of 23% for the same direction and 52% for the opposite direction for the near-end crosstalk and 44% for the same direction and 39% for the opposite direction for the far-end crosstalk. The routing orientation can lead to a mean difference of 35% for the near-end crosstalk and 24% for the far-end crosstalk.
Keywords :
VLSI; crosstalk; driver circuits; inductance; integrated circuit interconnections; system-on-chip; crosstalk voltage evaluation; deep submicron process; digital chip; discrepancy rate; distributed RC models; driver circuits; far-end crosstalk; inductance; inductive effects; integrated circuit technology; near-end crosstalk; parallel coupled interconnects; routing orientation; switching speed; Capacitance; Coupling circuits; Crosstalk; Inductance; Integrated circuit interconnections; Integrated circuit technology; Predictive models; Routing; Voltage; Wires;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microelectronics, 2004. ICM 2004 Proceedings. The 16th International Conference on
Print_ISBN :
0-7803-8656-6
Type :
conf
DOI :
10.1109/ICM.2004.1434241
Filename :
1434241
Link To Document :
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