DocumentCode :
435736
Title :
Fully-depleted SOI CMOS devices with W/TiN gate
Author :
Lian, Juan ; Hai, Chaohe
Author_Institution :
Inst. of Microelectron., Chinese Acad. of Sci., Beijing, China
Volume :
1
fYear :
2004
fDate :
18-21 Oct. 2004
Firstpage :
273
Abstract :
TiN gate thin-film fully-depleted SOI CMOS devices were fabricated and discussed. Key process technologies were demonstrated. Compared with the dual polysilicon gate devices, the channel doping concentration of NMOS and PMOS can be reduced without changing the VT. This enhances the mobility. Symmetrical VT was achieved by nearly the same VT implant dose because of the near mid-gap workfunction of TiN gate.
Keywords :
CMOS integrated circuits; semiconductor devices; semiconductor doping; semiconductor thin films; silicon-on-insulator; thin film circuits; titanium compounds; NMOS; PMOS; SOI CMOS devices; TiN; channel doping concentration; implant dose; mid-gap workfunction; polysilicon gate devices; thin film; Doping; Implants; MOS devices; MOSFETs; Microelectronics; Semiconductor films; Silicon; Sputter etching; Thin film devices; Tin;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State and Integrated Circuits Technology, 2004. Proceedings. 7th International Conference on
Print_ISBN :
0-7803-8511-X
Type :
conf
DOI :
10.1109/ICSICT.2004.1435004
Filename :
1435004
Link To Document :
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