Title :
Fabrication and characteristics of Ti- and Ni-germanide Schottky contacts on n-Ge (100) substrates
Author :
Han, Dcdong ; Wang, Xin ; Wang, Yi ; Tian, Dayu ; Wang, Wei ; Liu, Xiaoyan ; Kang, Jinfeng ; Han, Ruqi
Author_Institution :
Inst. of Microelectron., Peking Univ., Beijing, China
Abstract :
Ti- and Ni-germanides were fabricated on n-Ge (100) substrates by sputtering metal Ti or Ni on Ge followed by a furnace annealing. The impacts of anneal temperature on the material the electrical properties of Ti- and Ni-germanide on n-Ge (100) substrates were investigated. The low temperature ∼300°C annealing helps to obtain the optimized Schottky contact characteristics in both Ti-germanide/Ge and Ni-germanide/Ge contacts. The well-behaved Ti-germanides/n-Ge Schottky contacts with 0.34eV barrier height were achieved by using a 300°C annealing process.
Keywords :
Schottky barriers; annealing; elemental semiconductors; germanium; nickel compounds; sputtering; substrates; titanium compounds; 0.34 eV; 300 C; Ni metal sputtering; Ni-Ge; Ni-germanide Schottky contacts; Ni-germanide-Ge contacts; Schottky contact characteristics; Ti metal sputtering; Ti-Ge; Ti-germanide Schottky contacts; Ti-germanide-Ge contacts; Ti-germanides-n-Ge Schottky contacts; anneal temperature; electrical properties; furnace annealing; low temperature annealing; n-Ge 100 substrates; Annealing; Contacts; Fabrication; Furnaces; Pattern analysis; Schottky barriers; Sputtering; Substrates; Temperature; X-ray scattering;
Conference_Titel :
Solid-State and Integrated Circuits Technology, 2004. Proceedings. 7th International Conference on
Print_ISBN :
0-7803-8511-X
DOI :
10.1109/ICSICT.2004.1435050