Title :
Young´s modulus characterization for the fragile low-k film by the improved surface acoustic waves technique
Author :
Xiao, Xia ; Hata, Nobuhiro ; Yao, Suying ; Kikkawa, Takamaro
Author_Institution :
Sch. of Electron. & Inf. Eng., Tianjin Univ., China
Abstract :
Low dielectric constant (k) materials applied for the ULSI interconnect insulator are required to meet the fast development of high-speed devices. Introducing nanopores into dielectrics reduces their k value effectively but also degrades the film hardness drastically. In this work, Young´s moduli of several promising porous low-k films are determined by an improved technique of surface acoustic waves (SAWs). The twin-transducer is introduced to insure the propagation alignment of the laser generated SAWs, consequently increasing the accuracy of the measurement.
Keywords :
ULSI; Young´s modulus; insulating thin films; integrated circuit interconnections; surface acoustic waves; ULSI interconnect insulator; Young modulus; film hardness; fragile low-k film; high-speed devices; laser generated SAW; low dielectric constant materials; nanopores; porous low-k films; propagation alignment; surface acoustic waves technique; twin-transducer; Acoustic waves; Degradation; Dielectric constant; Dielectric materials; Dielectrics and electrical insulation; Nanoporous materials; Sawing machines; Surface acoustic wave devices; Surface acoustic waves; Ultra large scale integration;
Conference_Titel :
Solid-State and Integrated Circuits Technology, 2004. Proceedings. 7th International Conference on
Print_ISBN :
0-7803-8511-X
DOI :
10.1109/ICSICT.2004.1435062