DocumentCode :
435825
Title :
Structure optimization and thermal annealing effect of IrMn-based bottom spin valves
Author :
Ouyang, Ke-Qing ; Fan, Zent-Xu ; Ren, Tian-Liang ; Liu, Li-Tian ; Liu, Hua-Rui ; Qu, Bing-Jun ; Li, Wei
Author_Institution :
Inst. of Microelectron., Tsinghua Univ., Beijing, China
Volume :
1
fYear :
2004
fDate :
18-21 Oct. 2004
Firstpage :
773
Abstract :
IrMn-based bottom spin valves fabricated by DC magnetron sputtering method were investigated. An optimized thickness (20Å) of buffer layer was proposed for the bottom pinned structure: Ta(41Å)/buffer layer/IrMn(82Å)/CoFe(28Å)/Cu(19Å)/CoFe(10Å)/NiFe( 45Å)/Ta(38Å); where buffer layer could be NiFe or Cu. With the optimized structure, high MR ratio (>8.5%) low coercivity (<0.8Oe); and high exchange bias field (>800Oe) were obtained. The thermal annealing effect on the GMR properties in bottom pinned structure was also studied. These simple bottom spin valves could be the promising robust giant magnetoresistance sensors for the automotive and industrial applications.
Keywords :
cobalt alloys; copper; interface magnetism; magnetic annealing; nickel alloys; rapid thermal annealing; spin valves; sputter deposition; tantalum; 20 Å; DC magnetron sputtering; GMR properties; Ta-Cu-IrMn-CoFe-Cu-CoFe-NiFe-Ta; Ta-NiFe-IrMn-CoFe-Cu-CoFe-NiFe-Ta; automotive application; bottom spin valves; buffer layer; giant magnetoresistance sensors; industrial application; structure optimization; thermal annealing effect; Annealing; Buffer layers; Coercive force; Glass; Magnetic field measurement; Magnetic sensors; Robustness; Spin valves; Sputtering; Vacuum systems;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State and Integrated Circuits Technology, 2004. Proceedings. 7th International Conference on
Print_ISBN :
0-7803-8511-X
Type :
conf
DOI :
10.1109/ICSICT.2004.1435117
Filename :
1435117
Link To Document :
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