• DocumentCode
    435865
  • Title

    AlGaN/GaN heterostructures: the dependences of electron density and mobility on barrier alloy composition

  • Author

    Zhang, Jin Feng ; Hao, Yue

  • Author_Institution
    Inst. of Microelectron., Xidian Univ., China
  • Volume
    3
  • fYear
    2004
  • fDate
    18-21 Oct. 2004
  • Firstpage
    2287
  • Abstract
    The effect of barrier alloy composition, x, on two-dimensional electron density and mobility are calculated for AlxGa1-xN/GaN heterostructures, both unintentionally doped and modulation-doped. For modulation-doped structures the possible effect of strain relaxation is also considered. The results agree with published experimental curves in tendency, i.e., when x increases, electron densities increase and electron mobilities decrease. By analyzing the effects of various scattering processes, it is revealed that the tendency of mobility vs. x is primarily determined by the rise of electron densities, which is further demonstrated when modulation-doping and strain relaxation are considered. Channel conductance vs. x is primarily determined by the factor with greater change, that is, electron density. Strain relaxation works counter to modulation-doping, and, as a result, the former is unfavorable and the latter is favorable to improving channel conductance.
  • Keywords
    aluminium compounds; electron density; electron mobility; gallium compounds; semiconductor doping; semiconductor heterojunctions; semiconductor process modelling; AlGaN-GaN; aluminium gallium nitride/gallium nitride heterostructures; barrier alloy composition; channel conductance; electron density; electron mobility; modulation-doped structures; scattering processes; strain relaxation; unintentionally doped structures; Acoustic scattering; Aluminum gallium nitride; Capacitive sensors; Electron mobility; Epitaxial layers; Gallium nitride; HEMTs; MODFETs; Optical scattering; Piezoelectric polarization;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated Circuits Technology, 2004. Proceedings. 7th International Conference on
  • Print_ISBN
    0-7803-8511-X
  • Type

    conf

  • DOI
    10.1109/ICSICT.2004.1435302
  • Filename
    1435302