DocumentCode :
435924
Title :
A new damage model for ion implantation simulation with molecular dynamics method
Author :
Wang, Rong ; Yu, Min ; Zhan, Kai ; Shi, Xiaokang ; Ji, Huihui ; Zhang, Jinyu ; Oka, Hideki
Author_Institution :
Inst. of Microelectron., Peking Univ., China
Volume :
2
fYear :
2004
fDate :
18-21 Oct. 2004
Firstpage :
1061
Abstract :
A new damage model for ion implantation simulation based on molecular dynamic method is introduced in this paper. The model not only describes the formation of point defects but also describe the effect of amorphous pockets. The new model is successfully incorporated into the simulator LEACS (Ran Yajun et al., 2000). Pre-amorphization implantation (PAI) (A. Al-Bayati et al., 2000) with Sb is simulated. The simulation shows obviously better agreement with the RBS results than that achieved with point defects only. The simulation with new damage model can simulate the dose effect in implantation of impurities. Simulations As of and B into single-crystal silicon at 3 kev agree with experimental data.
Keywords :
amorphisation; amorphous semiconductors; antimony; ion implantation; molecular dynamics method; silicon; 3 keV; LEACS; PAI; RBS; Sb; Si; amorphous pockets; damage model; impurities implantation; ion implantation simulation; molecular dynamics method; point defects; preamorphization implantation; single-crystal silicon; Amorphous materials; Chaos; Implants; Impurities; Ion implantation; Laboratories; Lattices; Region 7; Research and development; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State and Integrated Circuits Technology, 2004. Proceedings. 7th International Conference on
Print_ISBN :
0-7803-8511-X
Type :
conf
DOI :
10.1109/ICSICT.2004.1436689
Filename :
1436689
Link To Document :
بازگشت